International Organizing Committee:

·         Dan HERR, Semiconductor Research Corporation, USA

·         Makoto NAKASE, Japan Electronics and Information Technology Industries, Japan

·         Werner STEINHÖGL, European Commission Bruxelles, Belgium

European Committee:

·         Clivia SOTOMAYOR, Tyndall Cork, Ireland

·         Hugo DE MAN, IMEC Leuven, Belgium

·         Johann BARTHA, Technische Universität Dresden, Germany

·         Lothar RISCH, Qimonda Dresden, Germany

·         Michel BRILLOUET, CEA-LETI Grenoble, France

·         Patrick DEWILDE, TU Delft, Netherlands

·         Peter KÜCHER, Fraunhofer-Center Nanoelektronische Technologien Dresden, Germany

·         Roger DE KEERSMAECKER, IMEC Leuven, Belgium

·         Werner STEINHÖGL, European Commission Bruxelles, Belgium

Asian Committee:

·         Atsushi KUROBE, Toshiba Corporation

·         Hirochika NAKAJIMA, Waseda University

·         Hiroshi YASUDA, University of Tokyo

·         Hisatsune WATANABE, Semiconductor Leading Edge Technologies, Inc.

·         Jun'ichi SONE, NEC Corporation

·         Katsutaka KIMURA, Hitachi Ltd.

·         Makoto NAKASE, Japan Electronics and Information Technology Industries Association

·         Masataka HIROSE, National Institute of Advanced Industrial Science and Technology

·         Naoki YOKOYAMA, Fujitsu Laboratories Ltd.

·         Toshiaki IKOMA, Japan Science and Technology Agency

·         Toshiro HIRAMOTO, University of Tokyo

·         Yasuhiko ARAKAWA, University of Tokyo

·         Yasunori TOKUDA, Mitsubishi Electric Corporation

North American Committee:

·         Dan HERR - SRC, USA

·         Gernot POMRENKE - AFOSR, USA

·         Kang WANG - UCLA, USA

·         Michael FRITZE - DARPA, USA

·         Rajinder KHOSLA - NSF, USA

·         Ralph CAVIN - SRC, USA

·         Sylvain CHARBONNEAU - NRC, Canada

·         Wentai LIU - UC/Santa Cruz, USA